1>Xu W, Wei YG, Int.J.of Adhesion & Adhesives, Vol.40,pp.158-167,2013.

Influences of adhesive layer thickness on overall strength of metallic adhesive bonding structures;

2>Liu XM,Liu ZL,Wei YG, Tribology Letters, Vol.46, pp.167-178, 2012.

Nanoscale friction behavior of the Ni-film/substrate system under scratching using MD simulation;

3>Liang LH, Li MZ, Qin FQ, Wei YG, Philosophical Magazine,Vol.93,2012 (In press)

Temperature effect on elastic modulus of thin films and nanocrystals

4>Xu W, Wei YG, J Adhesion Sci.Tech. Vol.26, 2012 (In Press).

Assessments for impact of adhesive properties---Modeling strength of metallic single lap joints;

5>Liu XM, Liu ZL, Zhang ZQ, Zhuang Z, Wei YG, J.Comput.Theoret.Nanoscience, Vol.9, 2012 (In press);

Nanoindentation size effect interpreted by the dislocation nucleation mechanism;

6>Liu XM, Yang XB, Wei YG, Sci in China G, Vol.55, pp.1010-1017, 2012.

Yielding behavior of copper nanowire in the presence of vacancies;

7>Wei HJ, Wei YG, Mater. Sci. Eng. A. Vol.541, pp.38-44, 2012.

Interaction between a screw dislocation and stacking faults in fcc metals;

8>Xu W, Wei YG, Int. J. of Adhesion & Adhesives, Vol.34, 80-92, 2012.

Strength and interface fracture mechanism of adhesive joints;

9>Xu W, Wei YG, Comput. Mater. Science, Vol.53, 444-450, 2012.

Strength analysis of metallic bonded joints containing defects;

11> Chen SH, Feng B, Wei YG, Wang TC, Int. J. Solids & Struct., Vol.48, 3099-3111, 2011.

Prediction of the initial thickness of shear band localization based
on a reduced strain gradient theory;

12>Liang LH, Ma HS, Wei YG, JOURNAL OF NANOMATERIALS, Vol.2011, 670857, 2011.

Size-Dependent Elastic Modulus and Vibration Frequency of Nanocrystals；

13>Liang LH, You XM, Ma HS, Wei YG, JOURNAL OF APPLIED PHYSICS, Vol. 108, 084317, 2010.

Interface energy and its influence on interface fracture between metal and ceramic thin films in nanoscale；

14>Jiang Y, Wei YG, Smith JR, Hutchinson JW, Evans AG, Int. J. Mater. Res., Vol.101, pp.8-15, 2010.
First principles based predictions of the toughness of a metal/Oxide interface;

15>Wu B., Wei YG, Materials Science Forum, Vols.633-634, pp.39-53, 2010
A computational model for intergranular fracture in nanocrystalline and ultra-fine polycrystalline metals;

16>Chen XL, Ma HS, Liang LH, Wei YG, Comput. Mater. Sci., Vol.46, pp.723-727, 2009
A Surface Energy Model and Application to Mechanical Behavior Analysis of Single Crystals at Sub-micron Scale;

17>Wu XL, Zhu YT, Wei YG, Wei Q, Physical Review Letters, Vol.103, 205504, 2009
Strong strain hardening in nanocrystalline nickel;

18>Wei,Y., Zhao,H., Int. Journal of Solids & Structures, Vol.45, pp.3779-3792, 2008.
Peeling experiments of ductile thin films along ceramic substrates ---Critical assessment of analytical models;

19>Wei,Y.G., Hutchinson,J.W., Phil. Mag., Vol.88, 3841-3859, 2008.
Toughness of Ni/Al2O3 interfaces as dependent on micron-scale plasticity and atomistic-scale separation;

20>Wu B., Wei Y. Acta Mech. Solida Sinica, Vol.21, pp.189-197, 2008.
Simulations of Mechanical Behavior of Polycrystalline Copper with Nano-Twins;

21>You X., Zhao H., Wei Y. Acta Mech. Solida Sinica, Vol.21, pp.198-206, 2008.
Determinations of Interfacial Mechanical Parameters for an Al-Epoxy-Al2O3 System by Using Peel Test Simulations;

22>Wei Y., Li T., Xie H. Adv. Mater. Res., Vols.33-37, pp.591-596, 2008.
Interface Cracking and Particulate Size Effect in Particle-Reinforced Metal-Matrix Composites;

23>Cao,A.J., Wei,Y.G., Mao,S.X. JOM, Vol.60, No.9, pp.85-88, 2008.
Strengthening mechanisms and dislocation dynamics in twinned metal nanowires;

24>Liang,LH., Wei,YG., Li,BW. J.Phys.:Cond. Matter, Vol.20, 365201, 2008.
Thermal conductivity of composites with nanoscale inclusions and size-dependent percolation;

25>Cao,A., Wei,Y., Ma E., Physical Review B, Vol.77, 195429, 2008.
Grain boundary effects on plastic deformation and fracture mechanisms in Cu nanowires: Molecular dynamics simulations;

26>Liang,LH., Wei,YG., Li,BW. Journal of Appl. Phys., Vol.103, 084314, 2008.
Size-dependent interface phonon transmission and thermal conductivity of nanolaminates;

27>Cao,A., Wei,Y., Mao,X. Scripta Mater., Vol.59,pp.219-222, 2008.
Alternating starvation of dislocations during plastic yielding in metallic nanowires;

28>Cao,A., Wei,Y.,Mao,X. Appl. Phys. Letter, Vol.93, 086102, 2008.
Response to "Comment on 'Deformation mechanisms of face-centeredcubic metal nanowires with twin boundaries' " [Appl. Phys. Lett. 93, 086101, (2008)];

29>Zhao,H., Wei,Y. Acta Mech.Sinica, Vol.24,pp.297-303, 2008.
Inverse analysis to determine interfacial properties between metal film and ceramic substrate with an adhesive layer;

30>Zuo,S., Wei,Y., Acta Mech.Sinica, Vol.24, 83-89, 2008.
Microstructure observation and mechanical behavior modeling for limnetic nacre;

31>Zuo,S., Wei,Y., Acta Mech. Solida Sinica, Vol.20, 198-205, 2007
Effective elastic modulus of bone-like hierarchical materials;

32>Cao,A., Wei,Y., J. Appl. Phys., Vol.102, 083511, 2007.
Molecular dynamics simulation of plastic deformation of nano-twinned copper;

33>Cao,A., Wei,Y., Physical Review B, Vol.76, 024113, 2007.
Atomistic simulations of crack nucleation and intergranular fracture in bulk nanocrystalline nickel;

34>Zhao,H., Wei,Y., Int. Journal of Fracture, Vol.144, pp.103-112, 2007.
Determination of interface properties between micron-thick metal film and ceramic substrate using peel test;

35>Cao,A., Wei,Y., Mao,S.X., Appl. Phys. Letter, Vol.90, 151909, 2007.
Deformation mechanisms of face-centered-cubic metal nanowires with twin boundaries;

36>Cao,A., Wei,Y., Physical Review B, Vol.74, 214108, 2006.
Atomistic simulations on the mechanical behaviors of fivefold twinned nanowires;

37>Cao,A., Wei,Y., Appl. Phys. Letter, Vol.89, 041919, 2006.
Formation of fivefold deformation twins in nanocrystalline face-centered-cubic copper based on molecular dynamics simulations;

38>Wei,Y., Chen,X., Shu,S., Zhu,C., Int. J. Mult. Comp. Eng., Vol.4, pp.183-196, 2006.
Nonuniformity Effect of Surface-Nanocrystalline Materials in Nanoindentation Test;

39>Wei Y., Eur. J. Mech. A/Solids, Vol.25,pp.897-913, 2006.
A new finite element method for strain gradient theories and applications to fracture analyses;

40>Xu J, Wu N, Jiang C, Zhao M, Li J, Wei Y, Mao SX. Small, Vol.2, pp.1458-1461, 2006.
Impedance characterization of ZnO nanobelt/Pd Schottky contacts in ammonia,

41>Wei Y., Xu G., International Journal of Plasticity, Vol.21, 2123-2149, 2005.
A multiscale model for the ductile fracture of crystalline materials;

42>Wei Y., Shu S., Du Y., Zhu C., International Journal of Plasticity, Vol.21, 2089-2106, 2005.
Size, geometry and nonuniformity effects of surface-nanocrystalline aluminum in nanoindentation test;

43>Wei Y., International Journal of Solids and Structures, Vol.41, pp.5087-5104, 2004.
Modeling nonlinear peeling of ductile thin films---Critical assessment of analytical bending models using FE simulations;

44>Wei Y, Wang X & Zhao M. Journal of Materials Research, Vol.19, No.1, PP.208-217, 2004.
Size effect measurement and characterization in nanoindentation test;

45>Wei Y, Zhu C, Wu X. Science in China (Series G), Vol.47, No.1, pp.86-100, 2004.
Micro-scale mechanics of the surface-nanocrystalline Al-alloy material;

46>Wei Y, Qiu X & Hwang KC. Eng. Fract. Mech., Vol.71, PP.107-125, 2004.
Steady-state crack growth and fracture work based on the theory of mechanism-based strain gradient plasticity;

47>Wei Y & Hutchinson JW. J. Mech. Phys. Solids, Vol.51, PP.2037-2056, 2003.
Hardness trends in micron scale indentation;

48>Wei Y, Wang X, Zhao M, Cheng CM & Bai Y. Acta Mechanica Sinica, Vol.19 No.1., pp.59-70, 2003.
Size effect and geometrical effect of solids in micro-indentation test;

49>Qiu X, Huang Y, Wei Y, Gao H, Hwang KC. Mechanics of Materials, Vol.35, PP.245-258, 2003.
The flow theory of mechanism-based strain gradient plasticity;

50>Wei Y, Zhao M & Tang S. Acta Mechanica Sinica, Vol.18, pp.494-505, 2002.
Characterization of the fracture work for ductile film undergoing the micro-scratch;

51>Wei Y. Fatigue & Fract.of Engng Mater. & Struct., Vol.25, pp.433-444, 2002.
Constraint effects on the elastic-plastic fracture behavior in Strain
gradient solids;

52>Wei Y. Int. Journal of Fracture, Vol.113, pp.233-252, 2002.
Thin layer splitting along the elastic-plastic solid surface;

53>Tang S, Zhu C and Wei Y. Int. J. Nonl. Sci. & Numerical Simulation, Vol.3(3/4), pp.699-702, 2002.
Size effects in micro-bending deformation of mems device based on the discrete dislocation theory;

54>Tvergaard V, Wei Y, Hutchinson JW. Eur. J. Mech. A/Solids, Vol.20, pp.731-738, 2001.
Edge-crack in single crystals under cyclic loading;

55>Wei Y. Acta Mechanica Sinica, Vol.17, No.1, pp.45-58, 2001.
Particulate size effects in the particle-reinforced metal matrix composites;

56>Hohlfelder RJ, Maidenberg DA, Dauskardt RH, Wei Y, Hutchinson JW. Journal of Materials Research, Vol.16, No.1, pp.243-255, 2001.
Adhesion of benzocyclobutene-passivated silicon in epoxy layered structures;

57>Wei Y, Wang X, Wu X and Bai Y. Science In China(Series A), Vol.44,pp.74-82, 2001.
Theoretical and experimental researches of size effect in micro-indentation test;

58>Wei Y. Science In China (Series A), Vol.43, pp.509-516, 2000.
Microscale mechanics for metal thin film delamination along ceramic substrates;

59>Wang X, Wu X, Wei Y and Bai Y. Int.J. Nonl. Sci. & Numerical Simulation, Vol.1, pp.399-404, 2000.
Experimental study on the internal length parameters in nano-indentation;

60>Chen JY, Wei Y, Huang Y, Hutchinson JW & Hwang KC. Eng. Fract. Mech., Vol.64, PP.625-648, 1999.
The Near-Tip Asymptotic Fields in Phenomenological Strain Gradient Plasticity;

61>Wei Y & Hutchinson JW. Int. Journal of Fracture，Vol.95，pp.1-17，1999.
Models of interface separation accompanied by plastic dissipation at multiple scales;

62>Evans AG, Hutchinson JW & Wei Y. Acta Materialia，Vol.47，pp.4093-4113，1999.
Interface adhesion：effects of plasticity and segregation;

63>Wei Y & Hutchinson JW. Int. Journal of Fracture，Vol.93，pp.315-333，1998.
Interface strength，work of adhesion and plasticity in the peel test;

64>Wei Y & Hutchinson JW. Journal of Mech. Phys. Solids，Vol.45，pp.1137-1159，1997.
Nonlinear delamination mechanics for thin films;

65>Wei Y & Hutchinson JW. Journal of Mech. Phys. Solids，Vol.45，pp.1253-1273，1997.
Steady-state crack growth and work of fracture for solids characterized by strain gradient plasticity;

66>Wei Y & Hutchinson JW. Mat. Res. Soc. Proc., Vol.409, pp.163-170, 1996.
Mixed mode interface toughness of metal / ceramic joints.

67>Wei Y & Wang TC. Int. Journal of Fracture，Vol.73，PP.39-50，1995.
Fracture criterion based on the higher order asymptotic fields;

68>Wei Y & Wang TC. Eng. Fract. Mech., Vol.51, pp.547-553, 1995.
Characterization of elastic-plastic fields near stationary crack tip and fracture criterion;

69>Wei Y., Wang TC. Acta Mechanica Solida Sinica, Vol.8, PP.405-409, 1995.
Domination range of elastoplastic field at growing crack tip;

70>Wei Y，Yang W & Hwang KC. Science in China (Series A)，Vol.37，pp.1077-1087，1994.
Theoretical and experimental researches of post-microbuckling for fiber-reinforced composites;

71>Wei Y & Yang W. Acta Mechanica Sinica，Vol.9，PP.33-43，1993.
Post microbuckling of fiber bridging kink bands under compression;

72>Yang W & Wei Y. Int. Journal Damage Mech., Vol.1, pp.80-101, 1992.
Progressive damage along kink bands in fiber-reinforced composite blocks under compression;


《二》论文被SCI杂志引用次数

截止2010年12月，论文共被SCI杂志他人引用约 1000 多次；
单篇被引用的最高次数为 140 多次。


《三》发表在 MRS-Proceedings 上的系列论文：

73>Wei Y., Jiang D., Cao A., Zhao H. Mat. Res. Sco. Symp. Proc.,Vol.854,pp.119-124, 2005.
Surface instability of microscale multilayer thin film system.

74>Wei Y., Shu S., Du Y. Mat. Res. Sco. Symp. proc.,Vol.795, pp.137-142, 2004.
Solutions and discussions of thin film undergoing the nonlinear peeling.

75>Wei Y., Du Y., Shu S., Zhu C. Mat. Res. Sco. Symp. Proc., Vol.788, pp.437-442, 2004.
Size effect characterization for nanostructured material in nanoindentation test.

76>Wei Y, Zhao M & Tang S. Mat. Res. Sco. Symp. Proc., Vol.750, pp.158-163, 2003.
Failure mechanism researches of material surface and interface in micro-scratch test.

77>Wei Y, Zhu C & Wu X. Mat. Res. Sco. Symp. Proc., Vol.740, pp.425-430, 2003.
Compressive behavior for surface-nanocrystallized Al-alloy material.

78>Wei Y, Zhao M, Wang X & Tang S. Mat. Res. Soc. Symp. Proc., Vol.731, pp.275-280, 2002.
Size effect and geometrical effect of polycrystals and thin film/substrate system in micro-indentation test.

79>Wei Y. Mat. Res. Soc. Symp. Proc., Vol.697, pp.305-310, 2002.
Assessment of microscale test methods of peeling and splitting Along surface of thin-film/substrates.


《四》其他杂志论文：


80>Mao SX, Ennis BM, Wei YG. Shallow and deep nanoindentation on W/NbN nanolayers, Solid Mechanics & Its Applications, Vol.144, pp.153-159, 2007.

81>Wei YG, Zhao HF, Shu SQ. Measurements and simulations of interface behavior in metal thin film peeling along ceramic substrate, Solid Mechanics & Its Applications, Vol.144, pp.61-70, 2007.

82>Wei Y., Xu G., Multi-scale characterizations of ductile thin film delamination, Solid Mechanics & Its Applications, Vol.142, pp.13-22, 2006.

83>Feng LP, Shao TM, Jin YJ, Fleury E, Kim DH, Chen DR, Wei YG, Laser cladded AlCuFe plus Sn quasicrystalline composite coatings, Trans. Nonferrous Metals Soc. China, Vol.15, pp432-436, 2005.

83>许巍，魏悦广，胶结体系的胶结强度、粘结能及损伤破坏研究， 《固体力学学报》，Vol.32, pp.194-201, 2011.

84>吴波，魏悦广，谭建松，王建平，纳米晶 Ni 晶间断裂的数值模拟， 《金属学报》，Vol.45, pp.1077-1082, 2009.

85>解海鸥，马寒松，魏悦广，颗粒复合材料的界面断裂效应，《固体力学学报》，Vol.29，No.1, pp.1-6, 2008.

86>吴波，魏悦广，纳米孪晶铜力学性能和尺度效应研究，《金属学报》，Vol.43，No.12, pp.163-166, 2007.

87>左树春，魏悦广，骨类纳米结构生物材料的细观力学分析，《复合材料学报》，Vol.24, No.12, pp.95-99, 2007.

88>魏悦广，朱晨，武晓雷，表层纳米化铝合金材料的微尺度力学行为，《中国科学》G，Vol.33, No.5, pp.464-474, 2003.

89>魏悦广，考虑压头尖端曲率的弹塑性材料硬度的解答形式，《力学学报》，Vol.35, No.4, pp.509-512, 2003.

90>魏悦广，薄膜非线性撕裂三种弯曲模型的解答及讨论，《力学学报》，Vol.35, No.6, pp.677-689, 2003.

91>舒思齐，杜莹，魏悦广，神经网络专家系统在微材料结构力学中的应用，《工程力学》，Vol.20, pp.604-607, 增刊，2003.

92>杜莹，赵海峰，舒思齐，魏悦广，由残余变形反推微结构材料的应力应变关系，《工程力学》，Vol.20, 增刊，pp.173-176, 2003.

93>赵满洪、唐山、魏悦广，器件韧性渡膜微划痕破坏机理研究，《机械强度》，Vol.23, No.12,pp.437-442, 2001.

94>魏悦广. 金属薄膜沿陶瓷基界面脱胶的微尺度力学研究. 《中国科学》A，Vol.30，No.2, pp.154-160, 2000.

95>魏悦广，王学峥，武晓雷，白以龙, 微压痕尺度效应的理论和实验研究,《中国科学》A, Vol.30，No.11，pp.1025-1032, 2000.

96>魏悦广, 伴随微孔洞生长的裂纹弹塑性定常扩展,《力学学报》，Vol.32，No.3, pp.291-299, 2000.

97>魏悦广, 考虑孔洞损伤演化的延性材料断裂韧性, 《固体力学学报》，Vol. 21，增刊, pp.61-65, 2000.

98>魏悦广, 固体尺度效应宏微观关联理论和方法的研究进展, 《中国科学基金》，Vol. 14, No.4，pp.221-224, 2000.

99>魏悦广, 机械微型化所面临的科学难题—尺度效应, 《世界科技研究与发展》,Vol. 22, No.2, pp.57-61, 2000.

100>魏悦广,杨卫,黄克智, 纤维复合材料后微屈曲的理论和实验《中国科学》A，Vol.24, No.7, PP.768-776, 1994.

101>魏悦广，王自强. 扩展裂纹尖端弹塑性场的仿真模拟. 《中国科学》A, Vol.24，pp.1286-1292，1994.

102>魏悦广，王自强，扩展裂纹尖端弹塑性场，《力学学报》,Vol.26, No.1, P.39, 1994.

103>魏悦广，杨卫， 单向纤维增强复合材料的压缩弹塑性微屈曲，《航空学报》A，Vol.13, No.7, P.A388, 1992.

104>魏悦广，杨卫，黄克智， 复合材料压缩破坏模式的缺陷敏感性，《工程力学》，Vol.9, No.1, P.11, 1992.

105>魏悦广， 两向不等压作用下圆形巷道弹塑性分析摄动解,《岩土工程学报》，Vol.12, No.4, P.11, 1990.

106>魏悦广， 用摄动法计算椭圆形巷道的弹塑性问题,《工程力学》，Vol.7, No.2, P.93, 1990.

107>魏悦广， 无支护立井井筒极限深度的上限解答,《山东矿业学院学报》, Vol.9, No.2, P.159, 1990.

108>魏悦广, 对"用奇异函数法求解某些变截面梁的变形"一文的讨论, 《力学与实践》，Vol.10, No.2, P.56, 1988.


《五》专著（或其中一章）：


109>Bai YL, Zheng QS, Wei YG. (Editors). IUTAM Symposium on mechanical behavior and micro-mechanics of nanostructured materials, Springer,The Netherlands, 2007.

110>Wei YG, Wu XL, Zhu C, Zhao MH, Microstructure and microhardness in surface-nanocrystalline Al-alloy material, In Multiscaling in Molecular and Continuum Mechanics: Interaction of Time and Size from Macro to Nano, G.C. Sih (ed.), One Chapter, pp.369-387, 2007 Springer.

111>Wei Y & Hutchinson JW. Peel test and interfacial toughness, Chapter 5, In "Interfacial and nanoscale failure", Eds, W. Gerberich & W. Yang, Elsevier Science Publisher, Oxford, pp.181-217, 2003.

112> 黄克智，魏悦广，黄永刚， MSG应变梯度塑性理论和固体尺度效应，
黄克智、王自强主编“材料的宏微观力学与强韧化设计”之专著的一章，清华大学出版社，pp.26-72, 2003.

113>周洋，吴学仁，方岱宁，郑泉水，颜悦，魏悦广，典型先进材料的强韧化设计与实现，作为由黄克智、王自强主编的“材料的宏微观力学与强韧化设计”之专著的一章，清华大学出版社，PP.246-285, 2003

114>杨卫，魏悦广，复合材料在强压载荷下的细观不稳定性,《材料和结构的不稳定性》，PP.86-97, 科学出版社, 1993.

115>魏悦广，杨卫，纤维增强复合材料的细观压缩失稳，《复合材料及其结构的力学进展》，第三卷，第七章，PP.118-136, 武汉工业大学出版社, 1992.


《六》国际会议邀请报告及担任分会主席情况：

108>Wei YG, A Trans-Scale Model for Size Effects and Intergranular Fracture in Nanocrystalline and Ultra-fine Polycrystalline Metals, The 17th International Conference of Plasticity, Puerto Vallarta, Mexico, Jan.1-8, 2011.

（40分钟 Key-note邀请报告; 分会主席）

109>Wei YG, A Computational Model for Intergranular Fracture and Size Effect in Nanocrystalline Materials, 18th Eur. Conf. Fract, Dresden, Germany, Aug.30-Sep.3, 2010.

（30分钟邀请报告）

110>Wei YG, Interface Delamination Under Thermal Mismatch, Advances in Mechanics of Materials, Santa Barbara, USA, Sep.7-9, 2010.

（30分钟邀请报告）

111>Wei YG, Surface/Interface Energy Models for Describing the Trans-scale Mechanical Behaviors, Symposium of Sino-US Multiscale Computation Materials, Suzhou, China, Aug.3-6, 2010.

（40分钟邀请报告）

112>Wei YG, A Surface/Interface Model and Application to Nanoindentation Test of Nanocrystalline Metals, IUTAM Symposium on surface effects in the mechanics of nanomaterials and heterostructures, Beijing，China, Aug.10-13, 2010.

（30分钟邀请报告）

113>Wei YG, Surface effect and size effect in nanomechanics, The First International Symposium on Size Effect of Mechanical Behaviors, May 24-26, 2009, Beijing, China.

（邀请报告）

114>Wei YG, Surface/Interface Energy Models for Describing the Trans-scale Mechanical Behaviors, US-China NSF Workshop and Summer Institute of Bio- and Nano- Mechanics and Applications, July 2-7, 2009, Dalian, China.

（邀请报告）

115>Wei YG, A Surface Energy Model and Application to Mechanical Behavior Analysis of Single Crystals at Sub-micron Scale, International Conference on Materials for Advanced Technologies, Singapore, June28-July3, 2009.

（邀请报告）

116>Wei YG, Microscopic Mechanism of Cohesive Zone Model and Application to Interface Fracture Characterizations, International Conference on Advanced and Multiscale Material Modeling, Dortmund, German, Sep. 14-17, 2009. 

（邀请报告） 
 

117>Wei Y. & Zhao H.,On measurement and modeling of interfacial behaviors between thin films and substrates using peel test, The 22th ICTAM - Sub-section: Cohesive zone models of fracture and failure, Aug.24-29, Adelaide, Australia,2008.

(分会场邀请报告)  

118>Wei Y., Peeling simulations and experiments of ductile thin films along ceramic substrates, Symposium Honoring J.W. Hutchinson, ASME International Mechanical Engineering Congress & Exposition, Oct.31-Nov.6, 2008, Boston, USA.
（30分钟邀请报告）

119>Wei Y., You X., Chen X. Microscopic mechanism of cohesive zone model and application in interface fracture characterizations, The 18th International Symposium on Computational Mechanics of Materials, Oct.7-9, 2008, Beijing, China.
（30分钟邀请报告）

120>Wei Y., You X., Zhao H. Investigations of cohesive zone properties of the interface between metal film and ceramic substrate at nano- and micro-scales, 2nd International Conference on Heterogeneoue Material Mechanics, June 3-8, 2008, HuangShan, China.
（30分钟Key-note邀请报告）


121>Hutchinson J., Wei Y. Scaling issues in the fracture of metal/ceramic interfaces, IUTAM Symposium on Scaling in Solid Mechanics, Cardiff University,London, UK, June 25-29, 2007.
（60分钟Key-note邀请报告）

122>Wei YG,Li TP, Size-seneitivity and self-similarity in spherical indentation tests, The 13th International Symposium on Plasticity, Alaska, USA, June 2-6, 2007.
(40分钟 Key-note邀请报告; 分会主席)